The equipment and technical expertise to understand if the silicon you are analyzing is the silicon you developed for malicious additions, analyzing other devices for patten infringement, clone devices, or re-engineering of obsolete semiconductors.
Backside Sample Preparation
Thin samples Si, GaAs, and other semiconductors from the backside to 40um.
Decapsulation / Die Exposure
Wet decapsulation using acid jet fuming nitric and/or fuming sulfuric acid. Die decapsulation using heat or mechanical techniques. This process preserves any die level contamination for analysis or when the encapsulant is impervious to chemicals
This technique is used for transistor level detection of photon emissions (broad range of 500nm to 1.2um). We can also use complementary techniques to
localize heat dissipation.
Product teardowns, circuit extractions, GDSII layouts, construction analysis
Layer-by-layer deprocess and documentation to substrate using wet etching and/or dry etching techniques. We have extensive experience with CMP copper technology.
FIB (Focused Ion Beam)
Design Support: Design repair, probe pad deposition and circuit isolation. Our system is capable of mechanical probing of internal nodes to characterize AC/DC analog or digital signals
We provide cross-section service of Si, GaAs, InP, and other exotic semiconductors. This includes polishing “soft” samples not possible to cross-section by conventional methods.
We can laser or FIB isolate circuits and electrically characterize circuits with eight mechanical probes to our customers specifications.
Real Time X-Ray
Non-destructive inspection of wire bond, solder bump, PCB, etc… with measurement capability can be performed on our system. Real time video or digital images of X-ray session can be transmitted to customers the same day we receive the sample.
(SAM) Scanning Acoustic Microscopy
This service provides non-destructive imaging using ultrasonic waves to detect delamination, voiding, and various features in a sample.
(SEM/EDS) Scanning Electron Microscopy/Energy Dispersive Spectroscopy
Our system is capable of surface analysis with elemental mapping using backscattered or secondary electron imaging.
Turn-Key Failure Analysis
Full FA service on qualification failures, yield analysis, or customer returns can be provided by our staff of highly trained professionals. The service comes with a report completely detailing the analysis steps and results.