We provide cross-section service of Si, GaAs, InP, and other exotic semiconductors. This includes polishing “soft” samples not possible to cross-section by conventional methods.
We can laser or FIB isolate circuits and electrically characterize circuits with eight mechanical probes to our customers specifications.
Real Time X-Ray
Non-destructive inspection of wire bond, solder bump, PCB, etc… with measurement capability can be performed on our system. Real time video or digital images of X-ray session can be transmitted to customers the same day we receive the sample.
(SAM) Scanning Acoustic Microscopy
This service provides non-destructive imaging using ultrasonic waves to detect delamination, voiding, and various features in a sample.
(SEM/EDS) Scanning Electron Microscopy/Energy Dispersive Spectroscopy
Our system is capable of surface analysis with elemental mapping using backscattered or secondary electron imaging.
Turn-Key Failure Analysis
Full FA service on qualification failures, yield analysis, or customer returns can be provided by our staff of highly trained professionals. The service comes with a report completely detailing the analysis steps and results.