Sept 1, 2020:  Lee joined FirstPass in 2011 as Chairman of the Board, and holding the position of Chief Operating Officer (COO). Prior to FirstPass, Lee was the Vice President of Engineering for the Chip Set Engineering Group for AMD overseeing the transition of the engineering organization following the acquisition of ATI Technologies by AMD. Lee also held the position of Vice President of Engineering at Vitesse Semiconductor, establishing standardized Design Methodologies and Tools. Lee also held senior management positions at Sitera, Inc., Intergraph Corporation, and Sun Microsystems. He earned his Bachelor of Science degree in Electrical Engineering from North Dakota State University and a Master of Science degree in Electrical Engineering from San Diego State University.

About FirstPass Engineering
Incorporated in 1993, FirstPass Engineering (FPE) began with the goal of providing ASIC design services to the Mil/Aero marketplace. Company expertise soon expanded into commercial space and commercial devices.

From 2000 to 2005, FirstPass was a captive design house for Vitesse Semiconductor Corp., focusing on development of complex ASICs for the telecom market including Intelligent Switch Fabrics, PCI, and SATA type devices. FPE drove methodology improvements company-wide, especially in verification.

In 2005, FirstPass reincorporated as an independent design services company. FPE has enjoyed solid growth and has re-established t-itself as an outstanding provider of ASIC and FPGA design services.
FirstPass has remained ahead of the technology curve, maintaining our high level of expertise through the technical changes and advances in pre-silicon verification, tools, and methodologies.